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Written by Jennifer Shuttleworth
Q-Prime from Multek Flexible Circuits Inc. is a flexible circuit technology developed specifically for applications where efficient heat dispersion is required and is especially useful for LED applications. According to the company, a hybrid flexible laminate is manufactured with copper on one side and aluminum on the other. A specially designed thermally conductive adhesive is used. A protective film is laminated to the uncovered side of the aluminum to protect it through printed circuit board processing chemistries. In addition to protecting the aluminum layer, this film increases the emissivity of the back side surface compared to bare aluminum, allowing heat to radiate more rapidly, which lowers the LED operating temperature. According to Multek Flexible Circuits, a flexible printed circuit constructed with Q-Prime technology provides electrical interconnection, improved heat dissipation, reduced weight, and lower tooling cost when compared to other packaging methods such as standard flex bonded to rigid aluminum plates. Q-Prime is suitable for LED interconnection systems where reliable electrical connections, mechanical support, and effective heat removal are required. In addition, it is potentially useful for any application where an operating component generates heat that must be dissipated. Target automotive applications for Q-Prime include automotive taillights, daytime running lights, turn signals, head-up displays, and map lights.
Date: 15-Sep-2014 01:31 EDT
More of this article on the SAE International website
ID: 947
Q-Prime from Multek Flexible Circuits Inc. is a flexible circuit technology developed specifically for applications where efficient heat dispersion is required and is especially useful for LED applications. According to the company, a hybrid flexible laminate is manufactured with copper on one side and aluminum on the other. A specially designed thermally conductive adhesive is used. A protective film is laminated to the uncovered side of the aluminum to protect it through printed circuit board processing chemistries. In addition to protecting the aluminum layer, this film increases the emissivity of the back side surface compared to bare aluminum, allowing heat to radiate more rapidly, which lowers the LED operating temperature. According to Multek Flexible Circuits, a flexible printed circuit constructed with Q-Prime technology provides electrical interconnection, improved heat dissipation, reduced weight, and lower tooling cost when compared to other packaging methods such as standard flex bonded to rigid aluminum plates. Q-Prime is suitable for LED interconnection systems where reliable electrical connections, mechanical support, and effective heat removal are required. In addition, it is potentially useful for any application where an operating component generates heat that must be dissipated. Target automotive applications for Q-Prime include automotive taillights, daytime running lights, turn signals, head-up displays, and map lights.
Date: 15-Sep-2014 01:31 EDT
More of this article on the SAE International website
ID: 947
